XGSP50,Solder Paste Sn63/Pb37,42G
SKU
TPSA0113
Part Number
XGSP50
Brand:
Categories:
AEDĀ 20.00
In stock


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The XGSP50 Solder Paste is a high-performance soldering solution designed for precision electronics repair and PCB assembly. Featuring a premium Sn63/Pb37 alloy, this leaded solder paste offers exceptional soldering performance, ensuring strong, reliable joints and reducing the likelihood of defects.
With a particle size range of 25-45um, the XGSP50 solder paste ensures consistent application and precise soldering, making it ideal for fine-pitch components and intricate PCB work. Its optimal viscosity allows for smooth application, holding components securely in place during the soldering process.
Packaged in a convenient 42-gram container, this solder paste provides ample quantity for multiple projects while ensuring it remains fresh and effective. The low melting point of the Sn63/Pb37 alloy makes this paste easy to work with, suitable for both professionals and DIY enthusiasts.
Whether you're working with SMD components, fine-pitch ICs, or general PCB assembly, the XGSP50 solder paste delivers reliable performance and excellent wetting properties, ensuring strong and durable connections. Compatible with various soldering methods, this paste is a versatile addition to any electronics toolkit.
Key Features :| Type | Solder Paste |
|---|
|
Stock |
Shipping Method |
ETA |
Cost |
|
|
Available |
Self Pickup |
1 Day |
Free |
|
Available |
inside UAE |
2 - 3 Days |
22 AED / Free Above 50 AED |
|
Available |
International |
4 - 7 Days |
180 AED / 49 $ |
|
pre-order |
General |
4-5 Weeks |